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The following photo shows a cooling system on the main board.
Cooling components, such as fan, heat pipes, clips, cooler modules, thermal pad and grease express overall heat dissipation capbility.
Thermal wind tunnel and natural convection chamber help to simulate a controllable environment.
The thermal resistance Rjc of IC package also can be measured by LW-9150.
The following photo shows a chassis of desktop PC.
PSU's fan noise, system impedance, RQ test, PCB's overall thermal performance and flow pattern of the chassis system
result in the thermal solution.